School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia
School of Aerospace Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia
Intel Technology Sdn. Bhd, Kulim Industrial Technology Park, Kedah, Malaysia
The fluid/structure interaction (FSI) investigations of stacked chip in encapsulation process of moulded underfill packaging using the two-way Coupling method with ANSYS Fluent and ANSYS Structural solvers are presented. The FSI study is executed with different aspect ratio of stacked chip on the mould filling during the encapsulation process. The simulation results in the FSI study is well validated with experimental setup. The epoxy moulding compound (EMC) and structure (chip) interaction is analyzed for better understanding the FSI phenomenon.Von Mises stresses experienced by the chip also be monitored for risk of chip cracking. The proposed analysis is anticipated to be a recommendation in the chip design and improvement of 3D integration packages.